
Session Number IWTh6 • Room #154
June 11 • 1:30 p.m. – 3:10 p.m.
Solve Your Toughest RF Signal Challenges
RF systems are pervasive across modern communications, defense, aerospace, and sensing platforms, and today’s increasingly congested spectrum demands unprecedented levels of signal fidelity. Meeting these performance requirements depends on next-generation solutions that deliver exceptionally low loss, noise, and distortion across the entire signal chain.
Join this expert-led workshop to explore how advancements in interconnects, passive components, printed circuit board (PCB) design, and system-level integration are enabling engineers to preserve signal integrity, reduce performance tradeoffs, and build more robust, high-performance RF systems for mission-critical applications.
Attendees will also be able to review physical product samples during the session, providing hands-on context.
What to Expect
Who Should Attend
Why Attend
Check Out the IMS Round Table Interview
Microwave Journal speaks with industry experts about their upcoming IMS 2026 workshop taking place Thursday, June 11 at 1:30 p.m. in Room 154.
This expert-led session will examine how innovations in interconnects, passive components, printed circuit boards (PCBs), and system-level integration are helping engineers reduce loss, noise, and distortion in next-generation microwave systems.
Meet the Panelists
Chris Cooper
Christopher holds a B.S. in Electrical Engineering Technology from Purdue University and an M.S. in Systems Engineering from Florida Tech. He has 20 years of experience as an RF and analog designer, specializing in RF distribution networks, signal intelligence (SIGINT), and wideband multi-functional phased‑array collection systems.
Colby Hobart
Colby Hobart has spent over 20 years supporting passive devices for defense radar front ends, with a career split between distributed element circuit and antenna design and PCB applications and manufacturing. He comes from Amphenol Printed Circuits in Nashua where he is currently the RF Applications engineer, covering radar and signal integrity circuit boards and assemblies.
Evan Tarr
Evan has worked with passive coaxial interconnects and devices since beginning as an engineering intern at SV Microwave more than 20 years ago. Between extensive simulation experience, and hands-on lab work with VNAs and TDRs, he has supported a variety of development and troubleshooting including ultra-sensitive test and measurement equipment to Hi-Rel mil-aero and space components.
Phil Lenk
Since joining Micro-Coax in 2011, Phil Lenk has built a diverse technical foundation, excelling as an Operator, Project Engineer, and Field Sales & Applications Engineer. Now serving as Product Manager, Phil leverages his deep operational insight and customer-facing leadership to drive product strategy and roadmap development. His cross-functional expertise ensures a strong connection between complex customer requirements and high-performance RF product execution.
David Higginson
With nearly a decade of experience in the military RF industry I have seen my share of black magic at work. Drawing from various disciplines has aided me in becoming a more effective engineer and leader. With an Electrical Engineering background, I have worked on designs from RF Filters to Integrated Modules and now work directly with customers to guide them to optimal solutions that are repeatable, high quality and can be scaled for production.
Matt O'Leary
Matt O’Leary, a Mechanical Engineer by education, has built his career in technical sales within the interconnect industry since 2019, primarily with Amphenol. He currently serves as Director of Sales and Marketing for Amphenol XMA, a role he has held for the past two years, leading commercial strategy and customer engagement. His experience is focused on high-performance interconnect solutions for harsh environments, with particular emphasis on Mil-Aero, defense, and emerging quantum computing applications.